Structural And Chemical Analysis Of IC-Chip Cross Sections

By James DeRose, Thomas Pfeifer, Konstantin Kartaschew, and Robert Ranner, Leica Microsystems

This content is brought to you by Leica Microsystems, a Danaher Operating Company.

Discover how structural analysis and simultaneous chemical / elemental identification can be performed efficiently on microelectronic components using a surface targeting system for milling, sawing, grinding, and polishing and a 2-methods-in-1 solution for simultaneous visual and chemical analysis. Rapid, detailed material analysis can be achieved for a variety of workflows and applications in the electronics industry, including competitive analysis, quality control, failure analysis, and research and development.